do you remember? At this time in 2015, CSP technology has gradually become a hot topic. So, what technology will be the leader in 2016?
In 2015, the price of LED products continued to decline, and technological innovation became a great tool to improve product performance, reduce costs and optimize the supply chain. Under the pressure of terminal prices, the market has forced the LED enterprise technology upgrade, which has further promoted the application and popularization speed of new technologies.
Technological innovation has always been an important weight for companies to increase product value. On the one hand, CSP chip-scale packaging, flip-chip LED, de-energized module technology has gradually matured and achieved mass production, and has been widely concerned by the industry. The next step is to improve cost performance; on the other hand, EMC, COB and high-voltage LED The market continues to break out and the future growth space will focus on market segments.
CSP chip scale package
Focus on the index: ★★★★★
Referring to the hottest LED technology in 2015, non-CSP is none other than. CSP has attracted much attention due to the industry's expectation of miniaturization of packaging and cost-effectiveness. At present, CSP is gradually being applied to mobile phone flash, display backlight and other fields.
It is worth mentioning that in 2015, CSP became an important device for direct-lit TV backlight design. As the TV sets from 2K to 4K, the higher the resolution, the higher the luminous flux requirements of the light source, and the brightness of the conventional medium power device cannot meet the requirements well. The unpackaged chip can reduce the light-emitting area, increase the optical density, make the light efficiency higher, greatly optimize the system structure, and the penetration rate in the backlight field is continuously improved.
However, CSPs are widely used in the field of lighting, and they face two major challenges in technology and cost performance. On the one hand, CSP is smaller than traditional chips and requires higher precision for placement equipment. This requires packaging companies to modify or replace equipment; on the other hand, CSP efficacy (lm/W) compared to SMD products. The advantage with the price/performance ratio (lm/$) is not obvious, and most lighting manufacturers are holding a wait-and-see attitude.
In short, at this stage, the domestic CSP chip-level package is still in the research and development period, and will develop along the track of improving cost performance. As the scale effect of CSP products continues to be released, the price/performance ratio will be further improved. More and more lighting customers will accept CSP products in the next year or two.
De-powered module
Focus on the index: ★★★★★
In recent years, “de-energization†has been in full swing, so what is “de-powering� "De-powering" means that the power supply is built in, and some components such as electrolytic capacitors and transformers are reduced. The driving circuit and the LED lamp bead share a substrate to achieve high integration of the driving and the LED light source. Compared with traditional LEDs, the power-off solution is simpler, easier to automate and mass-produce, and at the same time, it can reduce the size and cost.
The low-cost advantage of the “de-powered†solution has led to its rapid development. Now it accounts for about 10% of the LED lighting market, and it is mainly used in places where the quality of light is not high, which is represented by wall washers. With the advancement of technology, de-energized products will extend to high-quality lighting and lighting fields such as ceiling lamps, panel lights and downlights in the application field. It is expected to account for 30% to 40% of the market share in the next 1-2 years.
For the time being, there are still problems with "stroboscopic" and instability in power supply products. This results in de-energized products that can only be used in outdoor long-distance lighting, and cannot be used in indoor high-end lighting. Once the stroboscopic bottleneck is broken, the de-energization technology will impact the entire power ecosystem. In the long run, de-powering will have a large market development space due to its high cost performance.
Flip-chip technology
Focus on the index: ★★★★★
"Flip Chip + Chip Scale Package" is a perfect combination. Flip-chip LEDs have become the hotspot of LED chip companies such as Jingyuan Optoelectronics, Purui Optoelectronics, Sanan Optoelectronics, Dehao Runda and Jingke Electronics, and the mainstream direction of LED industry development in the past two years due to their high density and high current. .
Current CSP packages are based on flip-chip technology. Compared with the formal dressing, the flip-chip LED eliminates the need to hit the gold line, which can reduce the probability of the dead light by more than 90%, ensuring the stability of the product and optimizing the heat dissipation capability of the product. At the same time, it can withstand larger current drive, achieve higher luminous flux and thinner characteristics in a smaller chip area, and is the best solution for super current drive in lighting and backlight applications.
From the perspective of "the light source is smaller and the light efficiency is higher", flip-chip LED is undoubtedly the future development trend. At present, flip chip technology has been relatively mature, and the light efficiency has continued to increase, and it has entered the initial stage. In 2019, the proportion of flip-chip LED shipments could increase to 32%. As more and more LED manufacturers are investing in flip-chip LED technology to form economies of scale, there will be opportunities to further reduce costs. It is estimated that flip-chip LEDs will reach US$5.5 billion in 2017.
At this stage, the yield is not high, and the process is still immature, which increases the difficulty of marketing flip-chips. In the future, chips and packages need to work together to create low-cost, high-efficiency, high-performance flip-chip LEDs to meet market demand.
EMC package
Focus on the index: ★★★★
EMC refers to epoxy molding compound, which has the characteristics of high heat resistance, UV resistance, high integration, high current, small volume and high stability. It is used in the field of bulbs with strict heat dissipation requirements and outdoor lamps with high requirements against UV. The field and the backlight field requiring high stability have outstanding advantages.
Since the introduction and use of LED in the field of LED packaging in 2014, EMC has been greatly developed in indoor lighting, and has quickly become a mainstream product that competes with SMD and COB.
It is understood that EMC currently has several models such as 3030, 5050, 7070, etc., of which 3030 cost performance has been quite prominent. At the 2015 Guangya Exhibition, the 3030 package products can be seen everywhere, in addition to domestic Ruifeng, Smect, Hongli, Tiandian and Yiguang, as well as Osram, Seoul and other international big coffee layout 3030.
According to Zhang Luhua, the project director of Smide, from the perspective of the technology trend of the packaging industry, EMC will develop in two directions with the focus on 3030: one is to go in a small direction, mainly to the domestic PCT market; another package trend is to go to the big The direction of the main, the main market for COB. For example, for a 3 to 5 watt product, EMC costs much less than COB, but can achieve the same effect. It is expected that the next 5050/7070 will replace the COB's products within 15 watts.
High voltage LED package
Focus on the index: ★★★★
The current LED price war is fierce, and the power supply is prominent in the cost of the LED whole lamp. How to save the driving cost has become the focus of LED driver power companies. High-voltage LEDs can effectively reduce power costs and are recognized as one of the future trends in the industry.
At present, the common practice of improving LED brightness is to amplify the chip size or increase the operating current, but it is not easy to solve the problem fundamentally, and may even cause new problems, such as uneven current, poor heat dissipation, Droop Effect, etc., but high voltage chip. A better solution is provided.
The principle of the high-voltage chip is to adopt the concept of zeroing out, to decompose the larger-sized chip into a small chip with high luminous efficiency and uniform illumination, and integrate them through semiconductor process technology to make full use of the chip area. , to achieve the purpose of brightness improvement more effectively. From the perspective of the whole lamp (such as street lamps), the high-voltage chip is matched with the IC power supply, and the voltage difference between the power supply becomes small. In addition to increasing the service life, the cost of the system can also be reduced.
COB integrated package
Focus on the index: ★★★★
COB integrated light source is easy to achieve dimming color, anti-glare, high brightness and other characteristics, can solve the problem of chromatic aberration and heat dissipation, and is widely used in commercial lighting field, and is favored by many LED packaging manufacturers.
Since 2010, COB has gradually been accepted by the market. Especially in 2012, the domestic mainstream packaging plant has gradually increased the research and development of COB light source technology. The market is getting more and more accepted for COB light source, and the cost performance is becoming more and more reasonable.
Until 2015, COB developed rapidly in the field of commercial lighting, especially in the form of reflectors or lenses. It has become the mainstream solution for directional lighting, and the light quality is improved. At present, single high-power devices cannot match. The COB light source has also become the preferred source of medium power commercial lighting.
Since 2014, internationally renowned manufacturers, led by Philips Lumileds, Puri, Citizen, and Samsung, have successively launched new products in the field of high-efficiency COB, with a view to creating a high-quality, high-efficiency COB pattern. At the same time, the gap between COBs at home and abroad has further narrowed. It is expected that domestic COB companies will fully realize the comprehensive replacement of conventional imported COB products.
At this stage, COB is facing the process of customized demand, and the future COB market will develop towards standardized products. As the supporting facilities of COB upstream and downstream are relatively mature, the cost performance is also high. Once the versatility is solved, the scale will be further accelerated.
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