If technology is the engine of an industry, then the market is the steering wheel for this industry. In contrast, the LED industry in 2011-2012 is experiencing a new round of integration of technology and market. As the top event of the global LED industry, the 9th China International Semiconductor Lighting Forum & Exhibition (CHINASSL2012) will focus on the industry game focus, interpret the latest trends, and display cutting-edge technical achievements and design quality.
“Taking packaging as an example, LED packaging plays an important role in the entire industry chain, and is also one of the links that LED has the scale and cost advantage in the global industrial division of labor.†The person in charge of CHINASSL2012 Organizing Committee said: “Since 2011 - Since 2012, under the impetus of market demand, the packaging form has been transitioned from the initial LAMP, SMD to the new forms of High Power LED and COB.
COB packaging technology has received extensive attention once again. The latest test report of National Semiconductor Light Emitting Device (LED) Application Product Quality Supervision and Inspection Center shows that: China has developed a COB packaged light source with an input current of 20 mA and a luminous efficiency of 177 lm/W. LED, as always, refreshed the record of technological innovation, which also marked a new breakthrough in LED packaging.
As the world's top LED industry event, CHINASSL has been committed to the dissemination of the latest R&D achievements and technological innovations. This year's CHINASSL2012 (November 5-7, Guangzhou) will launch 7 technical sessions focusing on the cutting-edge technological achievements of various segments of the LED industry chain.
Material and equipment technology
The Council will focus on the two main factors that limit the performance and cost reduction of semiconductor lighting products, focusing on high-quality epitaxial material technology and excellent epitaxy equipment.
Thermal Management and Reliability Technology
It mainly involves solid lighting components (including LEDs, optics, drive circuits, control, thermal design, etc.), as well as the reliability of integrated systems. It will include heat dissipation optimization design, new heat dissipation methods, development of test technologies, accelerated test methods and reliability models, modeling and simulation, test standards and software development for all levels of packaging, modules and systems.
Chips, Devices, Packages and Modules
Focus on LED chips and devices to improve efficiency, reduce costs, improve yield, improve reliability, and other key issues. The main issues are how to improve the consistency of wafers, reduce the loss of chip classification, and prevent problems such as high-quality chip failure caused by lack of packaging materials and processes.
Drive, Power and Control Technology
With the continuous improvement of the LED lighting penetration rate and the decrease of LED cost, LED drive and control technology has also rapidly grown from a weak link to an important link that can brilliantly interpret the future light. The conference will discuss multi-channel drive technology, ultra-high-reliability drive technology, primary-side constant-current control technology, intelligent control technology, and intelligent dimming technology.
LED products and lighting engineering design
With the improvement of LED light quality, it is possible to compete with traditional light sources in applications. How to avoid weaknesses in LED products and lighting engineering design to create an ideal light environment? How to ensure the safety of photobiological security, to achieve variable light color, stepless dimming, rapid ignition and easy to accept intelligent system control, speed up the standardization The meeting will discuss this series of focus issues.
LED lighting application quality
The conference will share with the leading international experts the trends in the evaluation of light quality in LED lighting applications, and the latest recommendations and standardization issues related to quality parameters in visual perception and cognition and biophysics. The content relates to but is not limited to: visual comfort/discomfort (eg glare, fatigue, disturbance light) of light-emitting diode lighting, light characteristics, circadian rhythm, photobiological effects, standardization of lighting applications, and sustainability of LED lighting effects. New results on lighting applications and their lighting solutions will also be discussed.
OLED display and lighting
Organic electroluminescent devices (OLEDs) have attracted widespread attention for applications in high quality flat panel displays and high performance solid state lighting. The world’s top scientists and engineers will be invited to present the latest developments in R&D in related fields, the broad application prospects of the emerging technologies and the latest market trends.
“Taking packaging as an example, LED packaging plays an important role in the entire industry chain, and is also one of the links that LED has the scale and cost advantage in the global industrial division of labor.†The person in charge of CHINASSL2012 Organizing Committee said: “Since 2011 - Since 2012, under the impetus of market demand, the packaging form has been transitioned from the initial LAMP, SMD to the new forms of High Power LED and COB.
COB packaging technology has received extensive attention once again. The latest test report of National Semiconductor Light Emitting Device (LED) Application Product Quality Supervision and Inspection Center shows that: China has developed a COB packaged light source with an input current of 20 mA and a luminous efficiency of 177 lm/W. LED, as always, refreshed the record of technological innovation, which also marked a new breakthrough in LED packaging.
As the world's top LED industry event, CHINASSL has been committed to the dissemination of the latest R&D achievements and technological innovations. This year's CHINASSL2012 (November 5-7, Guangzhou) will launch 7 technical sessions focusing on the cutting-edge technological achievements of various segments of the LED industry chain.
Material and equipment technology
The Council will focus on the two main factors that limit the performance and cost reduction of semiconductor lighting products, focusing on high-quality epitaxial material technology and excellent epitaxy equipment.
Thermal Management and Reliability Technology
It mainly involves solid lighting components (including LEDs, optics, drive circuits, control, thermal design, etc.), as well as the reliability of integrated systems. It will include heat dissipation optimization design, new heat dissipation methods, development of test technologies, accelerated test methods and reliability models, modeling and simulation, test standards and software development for all levels of packaging, modules and systems.
Chips, Devices, Packages and Modules
Focus on LED chips and devices to improve efficiency, reduce costs, improve yield, improve reliability, and other key issues. The main issues are how to improve the consistency of wafers, reduce the loss of chip classification, and prevent problems such as high-quality chip failure caused by lack of packaging materials and processes.
Drive, Power and Control Technology
With the continuous improvement of the LED lighting penetration rate and the decrease of LED cost, LED drive and control technology has also rapidly grown from a weak link to an important link that can brilliantly interpret the future light. The conference will discuss multi-channel drive technology, ultra-high-reliability drive technology, primary-side constant-current control technology, intelligent control technology, and intelligent dimming technology.
LED products and lighting engineering design
With the improvement of LED light quality, it is possible to compete with traditional light sources in applications. How to avoid weaknesses in LED products and lighting engineering design to create an ideal light environment? How to ensure the safety of photobiological security, to achieve variable light color, stepless dimming, rapid ignition and easy to accept intelligent system control, speed up the standardization The meeting will discuss this series of focus issues.
LED lighting application quality
The conference will share with the leading international experts the trends in the evaluation of light quality in LED lighting applications, and the latest recommendations and standardization issues related to quality parameters in visual perception and cognition and biophysics. The content relates to but is not limited to: visual comfort/discomfort (eg glare, fatigue, disturbance light) of light-emitting diode lighting, light characteristics, circadian rhythm, photobiological effects, standardization of lighting applications, and sustainability of LED lighting effects. New results on lighting applications and their lighting solutions will also be discussed.
OLED display and lighting
Organic electroluminescent devices (OLEDs) have attracted widespread attention for applications in high quality flat panel displays and high performance solid state lighting. The world’s top scientists and engineers will be invited to present the latest developments in R&D in related fields, the broad application prospects of the emerging technologies and the latest market trends.
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