BSDL test of DS33R41 multi-chip module

Abstract: DS33R41 is an inverse multiplexed Ethernet mapper with a T1 / E1 / J1 transceiver. This application note describes how to change the netlist of a printed circuit board (PWB) for a design using DS33R41 to make it conform to the JTAG specification . Because the DS33R41 is a multi-chip module that contains multiple chips in a package, the boundary scan description language (BSDL) used for board-level joint test action group (JTAG) testing cannot define this situation, so these Changes are necessary. This application note contains the external pin mapping table, internal chip pad binding table, and the connection information required by the designer to quickly complete the correct JTAG boundary scan test.

Overview In the hardware manufacturing of telecommunication systems, one of the most basic tasks is to check for any production defects that may be contained in the system. Among the many hardware testing methods, one of the most commonly used methods is to use the Joint Test Action Group (JTAG) boundary scan method. The boundary scan test method will make some minor changes to the hardware before production, so hardware verification can be performed after production. In the design process, all integrated circuits (ICs) that support JTAG are connected in series in a daisy chain through the JTAG test interface, and verification is completed by a special JTAG test system connected to the test interface. The JTAG test system uses a printed circuit board ( PWB) Netlist, Boundary Scan Description Language (BSDL) files, and PWB connection test vectors verify point-to-point connections.

BSDL testing is simple. However, for multi-chip module devices, such as the inverse multiplexed Ethernet mapper DS33R41 with T1 / E1 / J1 transceivers, there is no way to include them in the BSDL file because they contain multiple die dies in one package Describe these devices correctly, but you can overcome this shortcoming by making minor changes to the PWB netlist and using two BSDL files to describe the device package.

Adjusting the netlist of the printed circuit board Before the JTAG boundary scan test, the part of the PWB netlist used to describe the external connection of the DS33R41 package must be split and adjusted to the connection of the internal DS33Z41 die and the DS21458 die. After completing this step, the netlist of the DS33R41 package will be defined by two independent reference numbers, which allow two different BDSL files to characterize the connection of the DS33Z41 and DS21458 inside the DS33R41 package, respectively.

Tables 1, 2 and 3 and Figure 1 can help achieve netlist adjustments. Table 1 lists the external package pins of all DS33R41 connected only to the DS33Z41 die, Table 2 lists the external package pins of the DS33R41 connected only to the DS21458 die, and Table 3 lists the DS33Z41 and DS21458 die The external package pins of the connected DS33R41. For easy reference, Figure 1 rearranges the same content.

The DS33R41 engineering evaluation board designed by Cadence® Concept software uses a reduced netlist format to verify PWB netlist adjustments and JTAG boundary scan testing. Depending on the type of netlist and the capabilities of the designer, this process can be completed in about 30 to 60 minutes. Most of the editing of netlist files can be done by a text editor, but depending on the type of netlist, it can also be edited by Microsoft® Excel. Excel can adjust rows based on column data. After finishing editing, we must pay attention to some details. Irregular data such as file header and tail information must be retained, and the netlist must also be saved in the original format.

The following is a list of steps to complete this process: Use a text editor to open the netlist file and group the network nodes connected to the DS33R41 reference number into the same group. For example, the reference number of the DS33R41 package on the DS33R41 engineering evaluation board is U01; the nodes that are grouped in the first step are connected to the DS33Z41, to the DS21458, and to both. Use Figure 1, Figure 2 and Figure 3 and Table 1 to complete this work; Change the node reference number of all DS33Z41 from U01 to U01_D1 (device 1 representing U01 reference number), this step assumes that the reference number of DS33R41 is U01, If the reference number is not U01, you can change U01_D1 accordingly; change all DS12458 node reference numbers from U01 to U01_D2 (device 2 representing U01 reference number), this step assumes that the reference number of DS33R41 is U01, if the reference number is not U01, You can change U01_D2 accordingly; copy 22 common nodes, so in fact each common node has two, divide them into the above two groups; change the node reference number assigned to the first group in step 5 from U01 U01_D1, this step assumes that the reference number of DS33R41 is U01, if the reference number is not U01, you can change U01_D1 accordingly; change the node reference number assigned to the second group in step 5 from U01 to U01_D2, this step assumes the reference of DS33R41 The number is U01. If the reference number is not U01, you can change U01_D1 accordingly; save the newly created netlist. The newly created PCB netlist file actually contains two examples of the physical device DS33R41. The first example describes the pin connection related to the DS33Z41 part; the second example describes the pin connection related to the DS21458 part. This new netlist and two DS33R41 BSDL files and any corresponding test vectors can be loaded into any JTAG test software.

Although the methods described in this document have been tested and verified to work properly, other netlist formats may have some unknown characteristics. If you need additional assistance during the JTAG boundary scan test, please use the contact information below.

Table 1. DS33Z41 die device pins
Pin DescripTIon Pin DescripTIon Pin DescripTIon
A1 VSS J18 RXD [2] P13 VSS
B16 VDD3.3 J19 RXD [0] P14 SDMASK [1]
B17 VDD3.3 J20 VSS P15 SRAS
B19 VDD3.3 K3 VSS P16 SDA [11]
B20 VDD3.3 K5 VSS P17 VDD1.8
C19 VDD3.3 K6 VSS P18 SDMASK [2]
C20 REF_CLK K7 VSS P19 SDATA [18]
D10 VDD3.3 K8 VSS P20 SDATA [19]
D15 VSS K13 RMIIMIIS R11 VSS
D18 VDD3.3 K14 TCLKE R12 SDATA [12]
D19 VDD3.3 K15 TSERO R13 SDATA [6]
D20 VDD3.3 K16 TBSYNC R14 SCAS
E19 VDD3.3 K17 JTDI1 R15 SDCS
E20 MDC K18 RX_DV R16 SBA [0]
F11 VSS K19 RX_CLK R17 SDA [10]
F14 VSS K20 RX_ERR R18 SDATA [31]
F18 VDD3.3 L4 VSS R19 VSS
F19 VDD3.3 L5 VSS R20 VDD1.8
F20 MDIO L6 VSS T11 SDATA [13]
G4 VSS L7 VSS T12 SDATA [14]
G5 VSS L8 VSS T13 SDATA [5]
G7 VSS L14 RCLKI T14 VDD1.8
G12 VSS L15 RBSYNC T15 SWE
G13 JTMS1 L16 RSERI T16 SDA [8]
G14 JTRST1 L17 DCEDTES T17 SDA [0]
G15 MODEC [1] L18 TX_CLK T18 SDATA [16]
G16 VDD3.3 L19 TX_EN T19 SDATA [27]
G18 QOVF L20 TXD [0] T20 SDATA [26]
G19 REF_CLKO M5 VSS U11 SDATA [15]
G20 VSS M6 VSS U12 SDATA [4]
H5 VSS M7 VSS U13 VSS
H6 VSS M12 VSS U14 SDCLKO
H7 VSS M13 VDD1.8 U15 VSS
H8 VSS M14 SDATA [3] U16 SDA [1]
H9 VSS M15 SDATA [1] U17 SDA [4]
H10 VSS M16 VSS U18 SDATA [29]
H14 JTDO1 M17 VDD1.8 U19 SDATA [25]
H15 RST M18 TXD [2] U20 SDATA [24]
H16 CS M19 TXD [1] V11 SDATA [11]
H18 RXD [1] M20 TXD [3] V12 SDATA [10]
H19 RXD [3] N12 VSS V13 SDATA [8]
H20 VSS N14 VDD1.8 V14 VSS
J6 VSS N15 VDD1.8 V15 SDA [9]
J7 VSS N16 VDD1.8 V16 SDA [7]
J8 VSS N17 VDD1.8 V17 SDMASK [3]
J9 VSS N18 VSS V18 SDATA [30]
J15 VSS N19 RX_CRS / CRS_DV V19 SDATA [22]
J16 VDD1.8 N20 COL_DET V20 VDD1.8
J17 JTCLK1 P12 VSS W11 SDATA [0]
W12 SDATA [9] W19 SDATA [20] T16 SDA [6]
W13 SDATA [7] W20 SDATA [23] Y17 SDA [2]
W14 VDD1.8 Y11 SDATA [2] Y18 VDD1.8
W15 SBA [1] Y12 VSS Y19 SDATA [28]
W16 SDA [5] Y13 SDMASK [0] Y20 SDATA [21]
W17 SDA [3] Y14 SYSCLKI
W18 SDATA [17] Y15 VDD1.8

Table 2. Device pins of the DS21458 die
Pin DescripTIon Pin Description Pin Description
A2 TSSYNC3 D3 TCHBLK3 G9 RNEGO2
A3 RMSYNC3 D4 RLOS / LOTC3 G10 DVSS
A4 RCHBLK3 D5 RSIG3 G11 DVSS
A5 RPOSO3 D6 TPD G17 D0
A6 TSYSCLK3 D7 RNEGO3 H1 RCLK3
A9 TCLK2 D8 DVDD H2 TSIG3
A10 TVDD D9 DVDD H3 DVSS
A11 TRING2 D11 DVDD H4 TSYSCLK1
A12 TTIP2 D12 RCLKO2 H11 RSIG2
A13 TVSS D13 TSYNC2 H12 RVSS
A14 TCHBLK2 D14 RCHCLK2 H13 RVSS
A15 RSYNC2 E1 TTIP3 J1 DVSS
B1 DVSS E2 TTIP3 J2 TSERI3
B2 DVSS E3 TCHCLK3 J3 TCLKT3
B3 RSYNC3 E5 RVSS J4 DVDD
B4 RCHCLK3 E6 RTIP3 J5 TSYSCLK2
B5 RSERO3 E8 DVDD J10 RPOSO2
B6 DVDD E9 DVDD J11 RVSS
B8 TSIG2 E10 DVDD J12 RRING2
B9 TSERI2 E11 TCLKO2 J13 RTIP2
B10 TVDD E12 TPOSO2 J14 RVDD
B11 TRING2 E13 TSSYNC2 K1 RSYSCLK1
B12 TTIP2 E14 RFSYNC2 K2 MCLK1
B13 TVSS F1 TRING3 K4 RSERO1
B14 RCHBLK2 F2 TRING3 K9 RSERO2
C1 RCLKO3 F3 TNEGO3 K10 RSYSCLK2
C2 TSYNC3 F4 TPOSO3 L1 RVSS
C3 DVSS F5 RVSS L2 TRTRST
C4 RFSYNC3 F6 RRING3 L3 BPCLK1
C6 RSYSCLK3 F7 RVDD L9 TCHCLK4
C7 JTDI2 F8 DVDD L10 JTDO2
C8 RCLK2 F9 DVDD L11 JTMS2
C9 DVDD F10 DVDD L12 MCLK2
C10 DVDD F12 DVSS L13 JTRST2
C11 DVDD F13 RMSYNC2 M1 RRING1
C12 TNEGO2 G1 TVDD M2 RVSS
C13 TCHCLK2 G2 DVDD M3 RSIG1
C14 RLOS / LOTC2 G3 TCLKO3 M4 TCHBLK1
D1 TVSS G6 RVSS M8 RCHBLK4
D2 TVSS G8 BPCLK2 M9 RSYNC4
M10 RFSYNC4 R5 DVSS V6 RNEGO4
M11 TCLKO4 R6 DVSS V7 RCHCLK4
N1 RTIP1 R7 TSERI4 V8 RLOS / LOTC4
N2 RVSS R8 RVDD V9 RMSYNC4
N3 RPOSO1 R9 RRING4 V10 DVSS
N4 RNEGO1 R10 RVSS W1 TRING1
N5 DVSS T1 TTIP1 W2 TVDD
N6 DVSS T2 TVSS W3 TSYNC1
N7 RCLK4 T3 DVSS W4 TSSYNC1
N8 DVSS T4 DVSS W5 RCLK1
N9 TCLKT4 T5 DVSS W6 CST
N10 TNEGO4 T6 DVSS W7 TVSS
N11 TPOSO4 T7 RSERO4 W8 TTIP4
N13 TSSYNC4 T8 RVSS W9 TRING4
P1 RVDD T9 RTOP4 W10 TVDD
P2 RCHCLK1 T10 RVSS Y1 RMSYNC1
P3 RCHBLK1 U1 TTIP1 Y2 RSYNC1
P4 TNEGO1 U2 TVSS Y3 TCHCLK1
P5 DVSS U4 TCLKT1 Y4 TSERI1
P6 TSYNC4 U5 DVSS Y5 TSYSCLK4
P7 TSIG4 U6 DVSS Y6 RSYSCLK4
P8 DVSS U7 RPOSO4 Y7 TVSS
P9 JTCLK2 U8 RSIG4 Y8 TTIP4
P10 RCLKO4 U9 DVSS Y9 TRING4
P11 TCHBLK4 U10 DVSS Y10 TVDD
R1 RFSYNC1 V1 TRING1
R2 RLOS / LOTC1 V2 TVDD
R3 TPOSO1 V4 RCLKO1
R4 TCLKO1 V5 TSIG1

Table 3. Common device pins for DS33Z41 and DS21458 die
Pin Description Pin Description Pin Description
A16 WR / RW C16 A9 E17 A6
A17 D1 C17 A7 E18 A4
A18 A5 C18 A2 F15 RD / DS
A19 A0 D16 D5 F16 D3
A20 A1 D17 A8 F17 D2
B15 D6 E7 MODEC [0] G17 D0
B18 A3 E15 INT
C15 D7 E16 D4

Figure 1. DS33R41 400 solder ball BGA pin layout
Detailed pictures (PDF, kB)

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