In September last year, Seoul Semiconductor was the first to introduce Wicop LEDs in the world, and it also attracted the attention of the industry. It is said that this technology is known as a new revolution that will subvert semiconductor packaging technology.
And this involves a problem that comes with it. The emergence of Wicop products may not be good news for traditional packaging manufacturers. With the proliferation of Wicop technology, the future status of packaging plants in the value chain will be replaced. Lost?
The development of the semiconductor chip industry follows Moore's Law. Once Nokia had more than 40% of the mobile phone market share, Sony Ericsson and Motolora all aimed to emulate Nokia, but when Jobs integrated mobile phones and computer functions, products such as smart phones appeared. At that time, both Nokia and Motolora are on the way to the end, not because people are planning ahead, only because the times are developing too fast.
The author also understands that Wicop is a more simplified design than CSP. Wicop's production process does not require traditional processes such as solid crystal, wire bonding, and dispensers, and does not require brackets or gold wires. And a variety of glue, just press the fluorescent film on the chip, a new generation of unpackaged LED will "stand out".
“In addition, the real CSP technology eliminates the need for additional substrates or leadframes, which can be directly attached to the carrier. At the same time, after the package substrate is removed, the package area of ​​the product is further compressed. This brings a higher light angle and optical density," according to Relien, general manager of Hongli Optoelectronics.
However, in terms of the technology of the current packaging factory, it is difficult to completely avoid the substrate temporarily, because most of the enterprises in the current production of CSP products, the use of flip chip bonding technology with the substrate, the existing CSP package is also mostly It is based on flip-chip technology.
For example, CSPs that are truly non-substrate on the market are rare. Currently, only large companies such as lumileds, Samsung, Seoul Semiconductor, and Dehao Runda are listed.
“All in all, in the future, whether it is WiCop, CSP or a more high-end series, whether it can play a revolutionary role, but its elimination of the inherent packaging process, the advancement of technology is still worthy of recognition. But no matter where A process to analyze, CSP will eliminate the life of the packaging company can not be established. Because no matter which level of packaging, packaging companies can participate, just to see whether to buy a finished chip or buy a whole wafer Encapsulation only." In this regard, Ralinen also mentioned.
Indeed, in the face of CSP's oncoming, we don't have to regard it as a savage beast. Its emergence is an innovation in the LED industry, but it is also a challenge, but also spawns more new opportunities. However, it is necessary to emphasize that in terms of the concept of "free packaging", the manufacturer's rendering gimmicks are still less talkative!
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