Why is the ultra-package micro-package chip very tricky?

Have you noticed? A new generation of operational amplifiers and other integrated circuits are rarely available in dual in-line packages. Integrated circuits that provide dual in-line packages are not economically viable when demand is low. Experimenting with ultra-compact micro-packaged chips on an analog board can be tricky. How to do it?

DIP adapters alleviate this thorny problem. You can use $10 to implement SO-8, SOT23 (3, 5, 6, or 8 pins) MSOP-8, SC70-6, SOT563-6 packages. We don't spend a penny on the adapter, we just want to try to make it easier to design with these tiny packages. In fact, you can use the CAD layout to modify or assemble from the line. You can optimize your classification to focus on the packages you use the most. I know that welding these integrated circuits requires a good welder, I can do it, and then use them in a circuit board like a dual in-line package.

We have other simulation board tests that you might find useful:

Universal Evaluation Board for SOT23, MSOP, SO-8 Packages - Each of the four layouts has a small analog board test area. Similar to the above, except that the op amp is equipped with a shutdown pin.

We all have our favorite analog board test methods. I often use a white universal socket to quickly check device behavior. These handy boards are circumvented by many analog experts because they add capacitance between adjacent lines that can change the performance of the circuit, so use them carefully. When a patch panel is used in an insensitive circuit portion, sensitive nodes may be in communication with air. These boards are not suitable for high speed or sensitive circuits, so it is necessary to make judgments about these situations. Some historical "parts ball" methods are fully functional, with small capacitance and small leakage. Sensitive components can be supported by a common PCB or solid copper PCB. The general PCB can be connected, and the solid copper PCB can be grounded. You may have seen some pictures of Bob Pease using this method, it is difficult to modify or fix it, it is more like a "solo". Your colleagues will have a hard time using, tracking or modifying. It will quickly fall into chaos, and even the author can hardly decode it.

With thoughtful design and circuit simulation, many of us directly prototype the board. If your current job involves only relatively familiar components and circuit technology, the risk of change is low. However, many hands-on experiments and optimizations are a must.

Fiber Optic Splice Closure

Fiber Optic Splice Closure,Fiber Optic Splice Case,Fiber Splice Closures,Outdoor Fiber Optic Splice Closure

Cixi Dani Plastic Products Co.,Ltd , https://www.dani-fiber-optic.com

This entry was posted in on