LED packaging technology is currently developing in four directions: high luminous efficiency, high reliability, high heat dissipation capability and thinning. At present, the main highlights are silicon-based LEDs and high-voltage LEDs. The reason why silicon-based LEDs have attracted more and more attention in the industry. Because it is more powerful than traditional sapphire-based LEDs, so the power can be made even larger. Cree focuses on the development of silicon-based LEDs. The main problem is that the yield is still low, resulting in cost high.
High-voltage LED is another bright spot. It can greatly reduce the input-output voltage difference of the DC-DC step-down circuit, and further improve the efficiency of the LED driver power supply , which can effectively reduce the requirements of the LED lamp for the heat-dissipating case, thereby reducing the LED lamp. The overall cost. Cree, Osram and Everlight are currently developing high voltage LED processes. Lin Zhimin, Director of Everlight's R&D Division II, said: "In the future, Everlight will expand its research and development of high-voltage LED products and integrate more components to create a compact light engine for easy application. The popularity of lighting is a part of the effort."
LED packaging principle
LED chip LED package is mainly to provide a platform for LED chip has better light, electricity, heat performance, good LED package may allow a better luminous efficiency and good thermal environment, good thermal environment and thus enhance the LED The service life. LED packaging technology is mainly built on five main considerations, namely optical extraction efficiency, thermal resistance, power dissipation, reliability and cost performance (Lm/$).
Each of the above factors is a very important part of the package. For example, the light extraction efficiency is related to cost performance; the thermal resistance is related to reliability and product life; and the power dissipation is related to customer applications. On the whole, the best packaging technology is to take care of every point, but the most important thing is to think from the customer's standpoint, to meet and exceed customer needs, is a good package.
For the packaging material composition of LED, Lin Zhimin explained in detail that the LED package is mainly composed of substrate, chip, solid crystal glue, phosphor, encapsulant, etc. We first paste the chip on the substrate with solid crystal glue, using gold. The wire electrically connects the chip to the substrate, and then mixes the phosphor with the encapsulant, and the different phosphor ratios, and the appropriate chip wavelength, can obtain different colors, and finally the mixture of the phosphor and the encapsulant is poured into the substrate. After heating and baking to cure the glue, the most basic LED package is completed.
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