The world's leading supplier of electronic components - Kemet Electronics (KEMET), announced for harsh environment applications KPS-MCCC0G high temperature 200 ℃ large capacitance solutions. These capacitors / NPO base metal electrodes (BME) dielectric system and durability of the lead frame technology developed by combining Kemet Electronics stable Patent C0G, very suitable for such a downhole oil exploration, automobiles and hybrid electric vehicles (the HEV), defense and aerospace High temperature, high pressure and high vibration applications such as aerospace.
The Kemei Electronics C0GBME dielectric system is designed to provide high reliability at operating temperatures up to 200 ° C while maintaining high insulation resistance, very low ESR and very high ripple current capability at high frequencies. In addition, the series has excellent stability, no capacitance change under DC voltage, and only ±30ppm/°C capacitance change with temperature change. High melting point (HMP) solder for wire bonding allows multiple chips to be stacked in parallel, providing large capacitance and providing excellent mechanical strength. Kemei Electronics' BMEC0G dielectrics offer excellent electrical performance, high reliability and mechanical strength, providing an excellent solution for applications above 175°C compared to Class II (X7R/X5R) capacitors.
The KPS-MCC series is available in three form factors and offers up to 2,000V and up to 2μF in less than 0.55 square inches. Each form factor can be arranged in a linear lead, "L" or "J" shaped structure with a silver (Ag) or solder (SnPb) coating on the terminals.
"This new product from the world-class BMEC0G product line of Kemei Electronics has expanded the product portfolio of Kemei Electronics' I-class solutions to 2μF." Dr. John Bultitude, vice president and technical academician of Kemei Electronics, said, "Based on Midea's temperature-resistant lead frame technology and high ripple current capability provide unparalleled performance in the harshest environments on the ground, underground and above ground."
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