On June 10th, the "2018 (16th) High-tech LED Industry Summit Forum" held by Gaogong LED was held in the Westin of the Canton Fair. The forum was divided into three special sessions. Among them, in the special session "upstream chip technology to create a new situation in downstream applications", Dr. Sun Zhijiang, Chairman of Heidico, delivered a keynote speech entitled "Industry Chain Innovation - Full-Scale Full Application WLCSP Light Source".
Sun Zhijiang, Chairman of Haidike, delivered a speech
As we all know, chip-scale packaging (hereinafter referred to as "CSP") has many advantages: free gold wire and bracket, small size, improved luminaire design freedom, high brightness, high density, etc., but relatively high packaging cost, so the main application In some special areas, including lights, flashlights, backlights, etc.
At present, the development and market of CSP light source is still in the development stage, so its large-scale application will have greater challenges. Dr. Sun Zhijiang introduced: First, CSP upper plate welding is more difficult, because the positive and negative electrodes are only 90-200 microns apart, the chip and solder paste need to be very accurate, but because the chip is in the package, it is slightly soldered. A little rotation and offset will cause difficulties in soldering; secondly, the chip placement and cutting error will cause the CSP side rubber thickness to be inconsistent, resulting in uneven side light emission; third, due to the uniformity and thickness of the phosphor distribution Side illumination is difficult to control, and the Bin rate is low after one application. Fourth, the film layer is thick and the heat dissipation is poor. Under high temperature and high humidity, the silica gel has poor airtightness, easy to drop powder, and easy to introduce bubbles.
Because of the above several technical problems, it brings the limitations of two market application levels: First, the small size chip CSP placement is more difficult, the current CSP application is mainly limited to 1W or more applications; second, the cost is high, resulting in Applications that make full use of CSP features in high optical density, high brightness, and high directivity are used, including headlights, flashlights, backlights, and high-end color-adjustable lighting applications.
In view of the technical and application limitations of CSP light source, Heidico has successfully developed an innovative product, WLCSP. Dr. Sun Zhijiang said that WLCSP is to extend the packaging process and chip process to the upstream chip process, package on the wafer scale to form an opaque core, and a semi-transparent phosphor surrounded by the outside.
Heidico WLCSP product appearance
"Compared with conventional CSP products, WLCSP has the following advantages: First, the position between the WLCSP light source and the luminaire substrate can be accurately aligned; Second, the phosphor into the bin rate is further improved; Third, the light extraction angle is optimized; Fourth, the improvement powder Body heat conduction and device hermeticity significantly improve reliability.†Dr. Sun Zhijiang added, “WLCSP light source can see opaque core and translucent phosphors, which can be placed against the core when placed. This is very convenient for many application manufacturers."
In addition, the exit angle of the WLCSP source can be adjusted. The C series products for lighting use 0620 chip can be used for two-color temperature filament lamps below 0.1W, and the products have uniform light color and high luminous efficiency; the high-power H series can maintain high reliability even in 5W ultra-high optical density applications. . For example, he said that in the side-entry backlight, a small-angle CSP is used, and a small size (0.5-1 mm width) CoreSP is used to achieve thinness and lightness, and the color temperature is intelligently adjusted to reduce the cost. In the case of direct-lit backlight, it is 155°. The large angle CoreSP can reduce the number of light sources and make the light mixing more uniform, intelligently adjust the color temperature and reduce the cost.
“The C series and H series can face the market's larger mid-to-high-end general-purpose lighting. WLCSP light source has excellent heat dissipation, high brightness, high reliability and low cost, and can be applied to the 0.1-5W full-size full-application white light application market.†Sun Zhijiang Dr. Yan said, "including the application of headlights, flashlights, backlights, etc., plus the small and medium-power C series products, basically the main scenes of white light application lighting, small to color temperature filament lamps and straight down and side-in panel lights All series can be easily faced."
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