The heat dissipation of the LED full-color display lamp shell will have different considerations depending on the power level and the place of use.
1. Air hydrodynamics, using the shape of the lamp housing to create convection air, which is the lowest cost of enhanced heat dissipation.
2. Thermally conductive plastic shells, filled with thermally conductive materials when plastic shells are injected, to increase the thermal conductivity and heat dissipation capacity of the plastic shells.
3. Aluminum cooling fins, which are the most common heat dissipation method, use aluminum cooling fins as part of the shell to increase the cooling area.
4. Radiation heat dissipation treatment on the surface. Radiation heat dissipation treatment is performed on the surface of the lamp housing. The simple method is to apply radiation heat dissipation paint, which can take the heat away from the surface of the lamp housing by radiation.
5. Heat pipe heat dissipation, using heat pipe technology to guide the heat from the LED full-color display chip to the heat sink fins of the housing. In large lamps, such as street lamps are common designs.
6. Fan heat dissipation. Long life and high efficiency fans are used to enhance heat dissipation inside the lamp housing. This method has low cost and good effect. However, changing the fan is troublesome and not suitable for outdoor use. This design is relatively rare.
7. Liquid bulb, using liquid bulb packaging technology to fill the transparent bulb with high thermal conductivity into the bulb of the lamp body. This is currently the only technology that utilizes the heat conduction and heat dissipation of the light emitting surface of the LED chip in addition to the principle of light reflection.
8. Heat conduction and heat dissipation integration-the use of high heat conduction ceramics, the purpose of heat dissipation of the lamp housing is to reduce the operating temperature of the LED full-color display chip, because the expansion coefficient of the LED chip is very different from that of our usual metal heat conduction and heat radiation LED chips cannot be directly soldered, so as to avoid high and low temperature thermal stress damage the LED full-color display chip. The latest high thermal conductivity ceramic material, thermal conductivity is close to aluminum, the expansion system can be adjusted to synchronize with the LED full-color display chip. In this way, heat conduction and heat dissipation can be integrated, and the intermediate process of heat conduction can be reduced.
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